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From sand to hand: How a CPU is made
Reach-me-down in semiconductors. It ultimately arrives in mono crystal ingots about 12″ in diameter (300mm today, the older ingots were 8″ or 200mm in diameter and smaller — the first wafers in the 1970s were 2″ in diameter, or 50mm).
The spotlessness at this level of refinement is about one part per billion, meaning only one foreign atom per billion silicon atoms. The ingot weighs about 220lbs, and is a 99.9999% decent vertical column of slick glass-looking physical.
Step 3 - Ingot Slicing
The ingot is cut with a very thin saw into individualistic silicon slices (called wafers), each of which are then polished to a perfect mirror-smooth surface. It is upon this totally smooth wafer top that the tiny copper wires are deposited in the following several steps.
Source: Geek.com
Array
If your looking for a secondary twist wire spacer that's built heavy duty for long life and keeps wires spread to a much safer distance than ...
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