Dessicant Bag

Preventing Board-level Defects with Moisture Control

"The vapor demand of moisture inside a non-hermetic package increases greatly when the bundle is exposed to the high temperature of solder reflow. Under assured conditions, this pressure can cause internal delamination of the packaging materials from the die and/or leadframe/substrate, internal cracks that do not develop to the outside of the package, bond damage, wire necking, handcuffs lifting, die lifting, thin film cracking, or cratering below the bonds. In the most severe case, the stress can result in surface package cracks. This is commonly referred to as the popcorn miracle because the internal stress causes the package to bulge and then rift with an audible pop. SMDs are more susceptible to this problem than through-hole parts because they are exposed to higher temperatures during reflow soldering."

Source: SMT Magazine

See Also

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