Distributor Dust Cover

Testing the Reliability of BGAs

In established final testing of BGAs, the socket pins perforation the solder balls to obtain a low contact resistance by mechanically breaking down the interfacial oxide layer. However, variations in the immensity and stability of the contact resistance are observed following repeated contacts between the pogo pin and the solder balls, as a denouement of interfacial phenomena between the crown tip and the oxide layer and the growth of particles from lead-free solder balls on the sovereign surface. To maintain a low contact resistance and a stable electrical friend, increase the drive force concurrently with the pogo pin contamination, and clear the crown tip on a regular basis. However, an excessive drive value creates large puncture marks on the solder ball, which not only expansion the risk of permanent pogo pin deformation, but may also adversely sham package performance and reliability. Furthermore, frequent abrasive cleaning reduces the socket's accommodation life. An appropriate tradeoff is required between contact Maquis and the number of allowable touch contacts between cleaning operations.

Source: SMT Magazine

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